JPS5999439U - ハイブリツドic用ペレツトマウンタ - Google Patents
ハイブリツドic用ペレツトマウンタInfo
- Publication number
- JPS5999439U JPS5999439U JP20169882U JP20169882U JPS5999439U JP S5999439 U JPS5999439 U JP S5999439U JP 20169882 U JP20169882 U JP 20169882U JP 20169882 U JP20169882 U JP 20169882U JP S5999439 U JPS5999439 U JP S5999439U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- hybrid
- mounter
- pellets
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims description 2
- 238000011017 operating method Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20169882U JPS5999439U (ja) | 1982-12-23 | 1982-12-23 | ハイブリツドic用ペレツトマウンタ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20169882U JPS5999439U (ja) | 1982-12-23 | 1982-12-23 | ハイブリツドic用ペレツトマウンタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5999439U true JPS5999439U (ja) | 1984-07-05 |
JPH0356048Y2 JPH0356048Y2 (en]) | 1991-12-16 |
Family
ID=30427188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20169882U Granted JPS5999439U (ja) | 1982-12-23 | 1982-12-23 | ハイブリツドic用ペレツトマウンタ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5999439U (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04226100A (ja) * | 1991-05-22 | 1992-08-14 | Matsushita Electric Ind Co Ltd | 電子部品自動装着装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5624940A (en) * | 1979-08-07 | 1981-03-10 | Nec Corp | Die bonding apparatus |
JPS56153742A (en) * | 1980-10-15 | 1981-11-27 | Shinkawa Ltd | Die-bonding device |
JPS5763836A (en) * | 1980-10-04 | 1982-04-17 | Shinkawa Ltd | Die bonding apparatus |
-
1982
- 1982-12-23 JP JP20169882U patent/JPS5999439U/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5624940A (en) * | 1979-08-07 | 1981-03-10 | Nec Corp | Die bonding apparatus |
JPS5763836A (en) * | 1980-10-04 | 1982-04-17 | Shinkawa Ltd | Die bonding apparatus |
JPS56153742A (en) * | 1980-10-15 | 1981-11-27 | Shinkawa Ltd | Die-bonding device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04226100A (ja) * | 1991-05-22 | 1992-08-14 | Matsushita Electric Ind Co Ltd | 電子部品自動装着装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0356048Y2 (en]) | 1991-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5999439U (ja) | ハイブリツドic用ペレツトマウンタ | |
JPS61263550A (ja) | マルチ自動基板検査装置 | |
JPS607200A (ja) | プリント基板への部品装着方法 | |
JPS6092836U (ja) | クリーニングウェハの保持機構 | |
JP3215444B2 (ja) | チップの実装方法 | |
JPS60179040U (ja) | 半導体ペレツト搭載装置 | |
JPS6059561U (ja) | 半導体装置 | |
JPS6117742U (ja) | 半導体製造装置 | |
JPS595203U (ja) | ロ−デイング装置の工作物反転装置 | |
JPS59121852U (ja) | 半導体装置 | |
JPS607118A (ja) | コンデンサ | |
JPS5963900U (ja) | メモリボ−ド | |
JPS5868062U (ja) | プリント基板供給装置 | |
JPS5916729U (ja) | 板材搬入位置決め装置 | |
JPS628515A (ja) | Ic形状 | |
JPS5878666U (ja) | 混成集積回路装置 | |
JPS5864127U (ja) | 圧電振動子ウエハ | |
JPS5995637U (ja) | ウエハ−移し替え装置 | |
JPS58143036U (ja) | プレスライン | |
JPS6022864U (ja) | 基板移送機構 | |
JPS59138959U (ja) | X−y座標移動装置 | |
JPS5893442U (ja) | 生産指示装置 | |
JPS5897848U (ja) | アウタ−リ−ドボンデイング構造 | |
JPS602834U (ja) | 位置決め機構 | |
JPS5885397U (ja) | テ−プ状保持構体 |